Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W
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Ball Grid Arrays
clean Pin-Fin array
dissipation Fin dimensions
External Height
External Length
External Width
heat dissipation Fin
Heat Sink
Heat Sink Material
holes Convenient peel
Information Thermal Resistance
maximize heat dissipation
mounting holes Convenient
Overview Tape mounting
Product Information Thermal
Product Overview Tape
saves board space
Tape mounting saves
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